MGS BP10

Fast setting bondings and repairs on composite structures in cooler temperatures.

BP10 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal. BP10 has a good degree of cure even at lower ambient temperatures. The cartridges allow for clean, selective application. To achieve full mechanical properties and thermal resistance, post-curing of at least 3h 60°C is recommended. However, good mechanical properties are already developed after initial curing of 24h at room temperature.

* Requires cartridge gun sold separately.

Features:

 

• Fast setting bonds for composites and metal
• Long shelf life (48 months) in originally sealed containers
• Good at temperatures above 5 degrees C (41 F)
• Economical, clean, and selective application by cartridges
• Developed for professional and industrial use, but safe and easy enough for home projects.

 

MGS BP10 can be shipped in individual cartridges (BP10-A) and boxes of 12 (BP10-B) via standard ground service, and by air, without hazard charges within the 48 contiguous United States.

MGS BP10 is available in individual cartridges (BP10-A) and boxes of 12 cartridges (BP10-B). Quantity discounts are available on orders of 10 or more boxes.